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phoenix microme|x DXR-HD

phoenix_micromex_DXR_HD

The phoenix microme|x DXR-HD is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI).

Innovative and unique features and an extreme high positioning accuracy make the system the effective and reliable solution for a wide spectrum of 2D and 3D inspection tasks: R&D, failure analysis, process and quality control as well as automated offline inspection. Optional the system can be equipped with Computed Tomography. The phoenix|x-ray x|act technology offers easy to program CAD based μAXI ensuring automated inspection in the micrometer range. Another unique benefit is GE´s highly dynamic DXR flat panel detector with active cooling. Offering up to 30 frames per second, it provides outstanding brilliant live imaging and fast data acquisition for 3D CT.

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Features

Key Features

  • High magnification
  • 180 kV / 20 W high-power microfocus tube with up to 0,5µm detail detectability
  • Brilliant live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
  • x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Precise Manipulation
  • High repeatability
  • 3D computed tomography scans within 10 seconds (optional)

Customer Benefits

  • Extremely high defect coverage and repeatability
  • Outstanding ease-of-use
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
  • Combined 2D / 3D CT operation

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Same X-ray tube parameter: 130 kV, 11.4 W

Applications

Power Electronics

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Soldering surface of a power transistor on a printed circuit board. The two light spots on the right are two large circular voids. (Learn More)

Semiconductor and Other Electronic Components

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High-magnification microfocus X-ray image of a copper bond wire with 25 µm diameter. (Learn More)

Mounted Printed Circuit Boards

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Microfocus X-ray image of BGA solder joints in top-down view with extreme high-resolution. (Learn More)

Accessories

  • CT option: includes software datos|x, high precision rotation unit, reconstruction workstation
  • quality|review: Repair station software for visualizing and manual review of results from an automatic program run, e.g. bga|module, qfp|module or vc|module.
  • converter: Software package to convert result files, generated by quality|assurance or x|act, into other formats, required by third party software.
  • quality|analyst: Software package for analyzing and visualizing inspection results, which are collected by an automatic program and reviewed with quality|review.

Specifications

Max. tube voltage 180 kV
Max. output 20 W
Detail detectability Up to 0,5 µm
Min. focus-object-distance 0.3 mm
Geometric magnification (2D) up to 1970-fold
Max. object size (height x diameter) 680 mm x 635 mm / 27" x 25"
Max. object weight 10 kg/ 22 lbs
Manipulation 5-axis sample manipulation
Detector GE DXR250RT, 30 fps at full frame, temperature stabilized
2D X-ray imaging yes
3D computed tomography yes (optional)
System size 1860 mm x 2020 mm x 1920 mm (73.2” x 79.5” x 75.6”)
System weight 2600 kg / 5070 lbs
Radiation Safety - Full protective radiation safety cabinet according to the German RöV (attachment 2 nr. 3) and the US Performance Standard 21 CFR 1020.40 (Cabinet X-ray Systems)
- Radiation leakage rate: < 1.0 µSv/h measured 10 cm from cabinet wall

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Corrosion Erosion Brochure acrobat-reader
Diamond Window Brochure acrobat-reader
Inspection Technologies Brochure acrobat-reader acrobat-reader acrobat-reader acrobat-reader
microme|x DXR-HD Brochure acrobat-reader acrobat-reader
Package Brochure acrobat-reader
PCBA Brochure acrobat-reader


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